FIRB
Development
of technologies for implementation of electronic components and
devices on textile substrates
funded by the Italian Ministry of
Education, University and Research)
The
goal of this project is the implementation of tecnologies for
building electronic structures on a textile substrate.
The
possibility of designing active electronic devices integrated on a
textile substrate allows to think of the same structure as a wearable
system, or more generally as a system suitable for covering surfaces
of whatever shape and able to elaborate electronic signals. Such
technology has many applications in a variety of fields, such as
biomedicine, sport, multimediality.
The need of mantaining the
mechanical flexibility of textiles reduces the possible materials and
technologies suitable for the aims of the project: electrical
conductivity and its modulation cannot be obtained through
traditional semiconductors (such as silicon and inorganic
semiconductors). Necessarily there is the need for materials whose
mechanical properties do not differ too much from those of textile
substrates.
Conductive polymers, at present investigated in the
field of molecular electronics, are the best candidates for
accomplishing such needs.
After solving the problem of materials,
suitable structures and architectures are to be studied. The problem
is complex and the goal appears to be achievable in, at least, two
ways: the electronically functionalized fabric can be obtained by
depositing the selected materials on it, according to a predetermined
geometry, or, the fabric can be obtained starting from a
functionalized fiber. This project aims to explore both solutions.
According to the first idea, deposition on fabric, the project will
concern technologies, already availble for one the partners, which
will be applied to the deposition of organic semiconductors on a
textile. In particular, we will consider the use of microsyringes
(pressure and/or volume controlled) and ink-jet heads for the
deposition of polymers diluted in volatile solvents. Alternatively,
the soft lithography approach to the deposition of geometrically
defined structures on a surface will be explored. Such technique is
applied, at present, both on planar substrates and on cilindrical
surfaces. This allows to think also to the soft lithography
functionalization of fibers. At the same time of the deposition
technologies, we will consider the problem of designing proper
structures according to their electronic functions. We will realize
simple passive circuit elements, like resistors and capacitors, and
we will explore the possibility of obtaining also active electronic
devices, like field effect transistors. Several exemples of Thin Film
Transistors have been successfully realized in the last years both on
rigid substrates (like silicon) and on flexible substrates
(polymeric). We will try to realize such a device on a fabric, which,
if necessary, will be preliminarily covered by suitable layers for
sake of homogeneity. Moreover, we will explore the possibility to
obtain electronic active properties directly on a fiber. Parallel to
the exploration of all possible deposition techniques, the assessment
of electronic properties of the obtained structures and the
maintainance of elasto-mechanical properties typical of a fabric will
be always taken into primary consideration.

Left: longitudinal section of an electronic ribbon-like textile structure; Right: scheme of a woven fabric where the vertical lines are made by the textile ribbons and the horizontal are conductive wires that represent source and drain contacts.